Defect location and class
bright-field and dark-field inspection
Material Analysis · Microscopy & Imaging
Micro-LED Wafer AOI Inspection
Characterise defect location and class, feature dimensions and placement, and wafer-level yield and spatial defect distribution using a scope agreed around your sample and decision.
- Price
- from£15 per sample, excl. VAT
- Turnaround
- 7 working days Preparation and scope dependent
- Available platforms
- KLA ICOS T7
- Typical outputs
- Wafer defect mapClassified defect image setYield and defect statisticsMethod-specific images
Why this test
What AOI can help you understand
Micro-LED Wafer AOI Inspection is selected when the project needs defensible information on defect location and class, feature dimensions and placement, or wafer-level yield and spatial defect distribution. Automated…
Feature dimensions and placement
multi-wavelength imaging
Wafer-level yield and spatial defect distribution
recipe development and automated classification
Choose the scope
Start from the question, not the instrument
The measurement mode, preparation route and reporting depth depend on what you need to learn from the sample.
Bright-field and dark-field inspection
defect location and class
- Best used when
- defect location and class
- Typical result
- Wafer defect map
- Preparation note
- Exact mass and any drying or dispersion step are confirmed after technical review.
Multi-wavelength imaging
feature dimensions and placement
- Best used when
- feature dimensions and placement
- Typical result
- Classified defect image set
- Preparation note
- State the substrate, nominal thickness and whether sectioning or mounting is permitted.
Recipe development and automated classification
wafer-level yield and spatial defect distribution
- Best used when
- wafer-level yield and spatial defect distribution
- Typical result
- Yield and defect statistics
- Preparation note
- Exact mass and any drying or dispersion step are confirmed after technical review.
Common outputs
A result package matched to the decision you need to make
Fields, measurement conditions, processing and file formats are confirmed before work begins.
Wafer defect map reported with the agreed units, sample reference and measurement conditions.
Classified defect image set supplied in a labelled format suitable for direct sample or condition comparison.
Yield and defect statistics provided with the processing basis and quality checks agreed during technical review.
Method-specific images included when selected in the confirmed reporting scope.
Sample requirements
What to send
Provide representative, clearly labelled samples and identify the region, feature or comparison that matters.
| Suitable sample or input | Submission requirement | Planning note |
|---|---|---|
| Powder / particles | Provide a dry, homogeneous and clearly labelled sample in a sealed container. | Exact mass and any drying or dispersion step are confirmed after technical review. |
| Film / coating | Provide the coated substrate or a flat film with the test surface and coating side clearly marked. | State the substrate, nominal thickness and whether sectioning or mounting is permitted. |
Region of interest: include a marked image, sketch or reference when the target feature is localised.
Handling: declare hazardous, magnetic, volatile, moisture-sensitive, beam-sensitive or temperature-controlled material before dispatch.
Questions and answers
Common planning decisions
Short answers to issues that can change preparation, scope or interpretation.
What should I send for Micro-LED Wafer AOI Inspection?
Provide powder / particles, film / coating as applicable. Exact quantity, dimensions and preparation are confirmed during technical review.
Which analysis option should I choose?
Choose the mode around the decision you need to make. For defect location and class, start with bright-field and dark-field inspection; add multi-wavelength imaging when comparison or quantification is required.
How long will the test take?
Typical turnaround is 7 working days after sample acceptance and method confirmation.
What can limit the result?
Optical AOI may not identify electrically inactive but visually normal devices. Classifier performance depends on representative training and acceptance criteria.
Configure the service
Send the information needed to scope AOI correctly
- Sample form, material, dimensions and quantity
- Feature or decision the result must address
- Marked region of interest where relevant
- Required comparison, output and reporting depth