What are threshold voltage, transconductance and on/off behaviour?
DC I-V characterisation
Performance Testing · Electrical & Electrochemical
Semiconductor Parameter Analysis
Characterise semiconductor devices using precision I-V, C-V, transfer, output and leakage measurements.
- Price
- from£120 per device, excl. VAT
- Turnaround
- 10 working days Preparation and scope dependent
- Available platforms
- Keysight B1500A
- Typical outputs
- Transfer and output curvesThreshold, transconductance and resistance metricsLeakage or breakdown responseC-V and extracted parameters where selected
Why this service
What Semiconductor Parameter Analysis can help you understand
Semiconductor parameter analysis applies controlled voltage or current sweeps to contacted devices and test structures. The required analyser modules, probes, switching and temperature control depend on…
How do leakage, breakdown or contact effects limit the device?
C-V characterisation
How do bias, temperature or pulsing change performance?
Pulse or temperature-dependent device testing
Choose the scope
Start from the question, not the tool
The method, preparation route and reporting depth depend on what you need to decide.
DC I-V characterisation
What are threshold voltage, transconductance and on/off behaviour?
- Best used when
- What are threshold voltage, transconductance and on/off behaviour?
- Typical result
- Transfer and output curves
- Preparation note
- Declare biological hazards and confirm fixation, dehydration, temperature and disposal requirements.
C-V characterisation
How do leakage, breakdown or contact effects limit the device?
- Best used when
- How do leakage, breakdown or contact effects limit the device?
- Typical result
- Threshold, transconductance and resistance metrics
- Preparation note
- Confirm the applicable standard, dimensions, loading direction and number of replicates.
Pulse or temperature-dependent device testing
How do bias, temperature or pulsing change performance?
- Best used when
- How do bias, temperature or pulsing change performance?
- Typical result
- Leakage or breakdown response
- Preparation note
- Confirm power, connections, operating state, access restrictions and permitted disassembly.
Common outputs
A result package matched to the decision you need to make
Fields, conditions, processing and file formats are confirmed before work begins.
Transfer and output curves reported with the agreed units, sample reference and measurement conditions.
Threshold, transconductance and resistance metrics supplied in a labelled format suitable for direct sample or condition comparison.
Leakage or breakdown response provided with the processing basis and quality checks agreed during technical review.
C-V and extracted parameters where selected included when selected in the confirmed reporting scope.
Sample requirements
What to provide before work begins
Provide representative, clearly labelled samples and identify the decision, feature or comparison that matters.
| Suitable sample | Submission requirement | Planning note |
|---|---|---|
| Biological / soft material | Provide fixed, preserved or otherwise stabilised material in the agreed container and medium. | Declare biological hazards and confirm fixation, dehydration, temperature and disposal requirements. |
| Test coupon / specimen | Provide labelled specimens prepared to the agreed geometry, orientation and surface condition. | Confirm the applicable standard, dimensions, loading direction and number of replicates. |
| Device / assembly | Provide a complete labelled device or assembly with drawings, interfaces and operating limits. | Confirm power, connections, operating state, access restrictions and permitted disassembly. |
Objective: state the decision, comparison or acceptance criterion the work must support.
Handling and access: declare hazards, instability, confidentiality, file constraints or special logistics before dispatch or transfer.
Questions and answers
Common planning decisions
Short answers to issues that can change preparation, scope, timing or interpretation.
Can an unpackaged die be tested?
Yes when pad dimensions, probe access, mounting and substrate connection are compatible with the probe station.
What is the typical turnaround?
Typical turnaround is 10 working days after sample acceptance and method confirmation.
Configure the service
Send the information needed to scope Semiconductor Parameter Analysis correctly
- Sample form, material, dimensions and quantity
- Feature or decision the result must address
- Required comparison, acceptance criterion or reference
- Preferred output and reporting depth